结构胶接接头湿热环境耐久性研究概述
CSTR:
作者:
作者单位:

作者简介:

通讯作者:

中图分类号:

基金项目:

国家自然科学基金(51605072);中国博士后科学基金(2015M581327);辽宁省教育厅科学研究一般项目(L2015109)


Review of research on the hygrothermal environmental durability of structural adhesively bonded joints
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    相比于传统机械连接,如铆接、焊接和螺栓连接,结构胶接技术有着诸多优势,近年来在很多工业领域得到了广泛应用。由于胶黏剂本身具有高分子聚合物材料的特性,使得胶接接头的环境耐久性成为关乎工程结构连接可行性和长期服役可靠性的关键问题。在概述结构胶接接头湿热环境耐久性研究工作的基础上,分别从影响胶接结构性能的环境湿度、温度及其耦合作用等角度展开讨论,介绍了国内外研究人员取得的研究进展和成果。指出了今后的研究方向:结合多种观测尺度下的环境老化试验和数值仿真方法,探究胶层吸湿、蠕变、热膨胀和吸湿膨胀等环境老化行为,利用模型预测方法模拟其在多场耦合工况下的多种力学性能退化行为,从而为胶接结构的工程设计和应用提供更加可靠的理论建模和试验数据支持。

    Abstract:

    In recent years, structural adhesive bonding technology has been widely used in many industrial fields, with many advantages over traditional mechanical connection methods, such as riveting, welding and bolt connection. Due to the adhesive characteristics of polymer materials, the environmental durability of adhesive joint becomes the key problems in engineering structure connection feasibility and long-term service reliability. On the basis of the review of the research of the hot-humid environmental durability of structural adhesive joints, the effects of temperature, moisture and coupled condition on the structural mechanical behaviour are discussed, introducing the published research progress and results both at home and abroad. The prospects are provided: the future research work can be combined with a variety of observation scales of environmental aging test and numerical simulation method, delve into sub hygroscopic, creep, thermal expansion and hygroscopic expansion aging behavior, such as the environment of model prediction method simulation in more than a variety of mechanical performance degradation behavior of coupling conditions, and provide more reliable theoretical modeling and experimental data for engineering design and application of cementing structure.

    参考文献
    相似文献
    引证文献
引用本文

韩 啸,金 勇,杨 鹏.结构胶接接头湿热环境耐久性研究概述[J].河北科技大学学报,2017,38(3):209-217

复制
分享
相关视频

文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:2017-01-09
  • 最后修改日期:2017-04-12
  • 录用日期:
  • 在线发布日期: 2017-06-28
  • 出版日期:
文章二维码