It is difficult to machine SiC single crystal slicing by diamond wire saw due to the high hardness and brittleness of SiC single crystal, the high wear speed of machine tool, low machining efficiency and high possibility of fragment and damage on the slicing surface or subsurface. So the manufacturing technology is critical to produce high-quality SiC single crystal slicing and high performance saw wire. In this paper, recent progress of manufacturing technology of SiC single crystal wire saw slicing and electroplated diamond wire saw is summarized. The problems in machining process are reviewed and analyzed. The research trend on SiC single crystal wire saw slicing technique is also presented.